Although recycled plastic particles have excellent physical and mechanical properties, but its relative price is still high, coupled with it is not easy to process into complex shapes and there is no electroplating problem, which limits its scope of use, it is difficult to meet the requirements of a new generation of electronic products. Therefore, the research and development of not only has excellent physical and mechanical properties, but also has easy processing, simple technology, low cost, adapt to environmental requirements of electronic packaging materials has become a top priority.
Since the traditional electronic packaging materials can not meet the requirements of modern packaging technology for packaging materials, the composite materials have become an inevitable trend. In this context, the metal matrix composites with low expansion and high thermal conductivity have been studied and developed. Compared with other electronic packaging materials, metal-based electronic packaging composites have the following advantages :(1) by changing the type, volume fraction and arrangement of the reinforcing phase, or changing the alloy composition of the matrix, or changing the heat treatment process, the thermal and physical properties of the materials can be designed.
The thermal expansion coefficient of recycled plastic particles is low and adjustable, which can be matched with the thermal expansion coefficient of electronic components, reduce the thermal stress of devices, and improve the long-term reliability of devices. At the same time, it has high thermal conductivity and low density, and has the characteristics of high thermal conductivity of metal and low expansion of ceramic particles.
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